The Sustainable Solutions Lab will be established in Taiwan in the future.

Taiwan has a highly comprehensive ecosystem of advanced cooling technologies in the world, with over 90% of data center servers being supplied by Taiwanese manufacturers.

Taiwan Intel has rolled out a comprehensive solution and reference design for Open IP data center immersion liquid cooling, marking the first authorization for ecosystem partners. According to Intel, the initial phase of the data center immersion cooling complete solution utilizes single-phase liquid cooling, immersing servers in a non-conductive liquid. The Intel reference tank design, with a 12U capacity, offers a cooling capacity of 15kW.

The design is compatible with both general-purpose and modular appearance specifications, ranging from 24U, 36U, 48U, up to 54U, and has the potential to achieve a cooling capacity of up to 180kW with system upgrades in the future.

The Intel Xeon Scalable Processor Proof of Concept has been completed recently, easily achieving a PUE of less than 1.15, surpassing the highest level of the Green Grid Alliance Platinum PUE of less than 1.25. In the future, the goal can be set at a PUE of less than 1.07 by optimizing system and server settings. In the near future, the first proof of concept for the actual application of the data center in the Asia-Pacific region will be completed, and it will be gradually promoted to the global market except the Asia-Pacific region. So far, many system integrator companies and thermal solution suppliers have strong interests in.

Intel point out that the power density of each rack in data center will increase significantly in 2025.

It has already developed 30~180kW single-phase immersion cooling capacity to cope with it.

In the second phase, it plans to establish Sustainability Solutions Lab to develop and validate solutions with partners.

In the third phase, will launch Two-Phase Immersion Cooling solution to increase the power density per unit.

The Sustainable Solutions Lab will be established in Taiwan in the future. Taiwan has a highly comprehensive ecosystem of advanced cooling technologies in the world, with over 90% of data center servers being supplied by Taiwanese manufacturers.

Taiwan Intel has rolled out a comprehensive solution and reference design for Open IP data center immersion liquid cooling, marking the first authorization for ecosystem partners. According to Intel, the initial phase of the data center immersion cooling complete solution utilizes single-phase liquid cooling, immersing servers in a non-conductive liquid. The Intel reference tank design, with a 12U capacity, offers a cooling capacity of 15kW.

The design is compatible with both general-purpose and modular appearance specifications, ranging from 24U, 36U, 48U, up to 54U, and has the potential to achieve a cooling capacity of up to 180kW with system upgrades in the future.

According to TSMC disclosure, this salutation is designed with supplier like DELTA ELECTRONICS (2308)、ACCTON TECHNOLOGY (2376)、MIRLE AUTOMATION INTER (2464)、3M etc.

By loading the airtight tank with low boiling point inert insulating coolant, directly immerse the server that needs heat dissipation in the tank. In addition to creating a good energy-saving effect, the computing performance will be increased more than 10%.

IRTI previously announced that will cooperate with related supply chains in Japan、the United State and Taiwan. Taiwan cooperate with Japanese telecom operators build an “immersive cooling edge data center.” Also, non-conductive liquid is used to dissipate heat for the server. The cooling system does not need to be completely sealed. But the energy saving can reach 40%.

Author Professor Wei-Keng Lin Education｜Ph.D., University of Maryland Occupation｜Professor, National Tsing Hua University  Specialty｜Electronic package heat dissipation, Heat pipe, Loop heat pipes(CPL，LHP，PHP), Energy-saving design, Solar heat storage and cooling, Heat flow system, Cooling of electronic components, Two-phase flow, Heat transfer elements of artificial satellite and high-altitude flying object